
Modular DC-DC system design done right
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To enable the highest performance in hyperscale data centers, we are changing the way GPU and AI processors are powered with our factorized power on package architecture. When board real estate and system weight is a business and engineering obstacle, we redefine the power density limitations of 3-phase AC, HVDC and 48V power distribution solutions, in automotive, industrial and defense markets. Solving the toughest power delivery challenges and enabling a competitive advantage for our customers can only be achieved if we stay on the forefront of power architectures, conversion topologies and packaging technology.
Modular DC-DC system design done right
PCB layout and thermal design for high-density modular power systems
Defense-electronics spending seeks to overcome COVID-19 setbacks in key applications
Expertise and power density drives new mobile robotics revolution